发明授权
- 专利标题： Semiconductor structures provided within a cavity and related design structures
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申请号： US16259190申请日： 2019-01-28
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公开(公告)号： US10882736B2公开(公告)日： 2021-01-05
- 发明人: Jeffrey C. Maling , Anthony K. Stamper , Dana R. DeReus , Arthur S. Morris, III
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Roberts Calderon Safran & Cole, P.C.
- 代理商 Steven Meyers; Andrew M. Calderon
- 主分类号： B81B3/00
- IPC分类号： B81B3/00 ; H01L29/84 ; H01L23/34 ; B81C1/00 ; H01L21/02 ; H01L41/09 ; H01H1/00
摘要：
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
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