Invention Grant
- Patent Title: 3D tap and scan port architectures
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Application No.: US16710679Application Date: 2019-12-11
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Publication No.: US10884057B2Publication Date: 2021-01-05
- Inventor: Lee D. Whetsel
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Charles A. Brill; Frank D. Cimino
- Main IPC: G01R31/317
- IPC: G01R31/317 ; G01R31/3177 ; G01R31/3185 ; G01R31/3183 ; G01R31/28
Abstract:
This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
Information query
