Invention Grant
- Patent Title: Electronic component
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Application No.: US16272752Application Date: 2019-02-11
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Publication No.: US10886071B2Publication Date: 2021-01-05
- Inventor: Ki Young Kim , Woo Chui Shin , Beom Joon Cho , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0141894 20181116
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/232 ; H01G2/06 ; H01G4/30 ; H01G4/12

Abstract:
An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.
Public/Granted literature
- US20200161056A1 ELECTRONIC COMPONENT Public/Granted day:2020-05-21
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