Invention Grant
- Patent Title: LED filament comprising conversion layer
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Application No.: US16197939Application Date: 2018-11-21
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Publication No.: US10886258B2Publication Date: 2021-01-05
- Inventor: Reiner Windisch , Florian Bösl , Andreas Dobner , Matthias Sperl
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: DE102017127721 20171123
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L33/50 ; H01L33/62 ; H01L27/15 ; H01L25/075 ; F21K9/90 ; F21V29/87 ; F21Y115/10

Abstract:
An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.
Public/Granted literature
- US20190157250A1 LED FILAMENT COMPRISING CONVERSION LAYER Public/Granted day:2019-05-23
Information query
IPC分类: