Laser device and method for manufacturing a laser device

    公开(公告)号:US12249807B2

    公开(公告)日:2025-03-11

    申请号:US17414671

    申请日:2019-12-18

    Abstract: A laser device comprises a carrier, an optoelectronic component provided on the carrier, said component being designed to emit laser radiation, and an optical element designed to form the laser radiation emitted by the optoelectronic component, wherein: the optical element has a first layer that is at least partially transparent to the laser radiation, with a first refractive index, and a second layer that is at least partially transparent to the laser radiation, with a second refractive index; the first layer being applied to the optoelectronic component and having a surface with an imprinted structure; and the second layer is applied to the first layer, on the surface (24) having the imprinted structure.

    LED FILAMENT COMPRISING CONVERSION LAYER
    2.
    发明申请

    公开(公告)号:US20190157250A1

    公开(公告)日:2019-05-23

    申请号:US16197939

    申请日:2018-11-21

    Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

    METHOD OF APPLYING A MATERIAL TO A SURFACE
    5.
    发明申请

    公开(公告)号:US20170317245A1

    公开(公告)日:2017-11-02

    申请号:US15524036

    申请日:2015-10-16

    Abstract: A method of applying a first material to a surface in a plurality of mutually separate coating regions includes: A) providing the surface containing the coating regions; B) producing a first masking layer on the surface by a photolithographic process, wherein the first masking layer includes a plurality of first openings arranged above the coating regions; C) providing a self-supporting second masking layer and then applying the second masking layer to the first masking layer, wherein the second masking layer includes a plurality of second openings arranged above the first openings and having a size less than or equal to a size of the first openings; and D) applying the first material to the surface in the coating regions through the first and second openings in the first and second masking layers.

    Radiation-emitting semiconductor component and production method of a plurality of semiconductor components

    公开(公告)号:US10396259B2

    公开(公告)日:2019-08-27

    申请号:US15565112

    申请日:2016-04-05

    Abstract: A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. The component further includes a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, wherein the thermal connector extends to the rear side of the semiconductor chip, wherein at least one electrical connection surface is located on the front side of the semiconductor chip, and wherein the at least one electrical connection surface is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body.

    Detection arrangement and method for producing detection arrangements

    公开(公告)号:US11486819B2

    公开(公告)日:2022-11-01

    申请号:US16323504

    申请日:2017-08-03

    Abstract: A detection assembly and a method for producing a detection assemblies are disclosed. In an embodiment a detection arrangement includes an emitter configured to generate radiation having a peak wavelength in an infrared spectral range, a detector configured to receive the radiation, a mounting surface comprising at least a first contact surface and a second contact surface for external electrical connection of the detection arrangement, a form body adjoining the emitter and the detector at least in places and deflection optics, on which the radiation impinges during operation of the detection arrangement so that an optical path is formed between the emitter and the detector by the deflection optics, wherein the deflection optics include a scattering body into which the radiation enters during the operation through a surface of the scattering body facing the emitter.

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