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公开(公告)号：US20190157250A1
公开(公告)日：2019-05-23
申请号：US16197939
申请日：2018-11-21
发明人： Reiner Windisch , Florian Bösl , Andreas Dobner , Matthias Sperl
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62
摘要： An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.
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2.发明授权公开(公告)号：US10193034B2
公开(公告)日：2019-01-29
申请号：US15328601
申请日：2015-07-08
发明人： Matthias Sperl , Frank Singer
摘要： A semiconductor device includes a semiconductor chip including an active region provided to generate radiation; a radiation exit face extending parallel to a main plane of extension of the active region; a molding directly adjoins at least one side face of the semiconductor device at least one back of the semiconductor chip remote from the radiation exit face; a mounting surface provided to mount the semiconductor device; and a spacer projecting beyond the radiation exit face in a vertical direction extending perpendicular to the radiation exit face.
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3.发明申请公开(公告)号：US20180145230A1
公开(公告)日：2018-05-24
申请号：US15877270
申请日：2018-01-22
发明人： Luca Haiberger , Matthias Sperl
摘要： An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.
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公开(公告)号：US20170317245A1
公开(公告)日：2017-11-02
申请号：US15524036
申请日：2015-10-16
摘要： A method of applying a first material to a surface in a plurality of mutually separate coating regions includes: A) providing the surface containing the coating regions; B) producing a first masking layer on the surface by a photolithographic process, wherein the first masking layer includes a plurality of first openings arranged above the coating regions; C) providing a self-supporting second masking layer and then applying the second masking layer to the first masking layer, wherein the second masking layer includes a plurality of second openings arranged above the first openings and having a size less than or equal to a size of the first openings; and D) applying the first material to the surface in the coating regions through the first and second openings in the first and second masking layers.
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公开(公告)号：US10396259B2
公开(公告)日：2019-08-27
申请号：US15565112
申请日：2016-04-05
发明人： Matthias Sperl , Frank Singer , Jürgen Moosburger
摘要： A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. The component further includes a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, wherein the thermal connector extends to the rear side of the semiconductor chip, wherein at least one electrical connection surface is located on the front side of the semiconductor chip, and wherein the at least one electrical connection surface is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body.
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公开(公告)号：US20170331018A1
公开(公告)日：2017-11-16
申请号：US15524114
申请日：2015-11-03
CPC分类号： H01L33/62 , H01L25/167 , H01L33/005 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.
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7.发明申请公开(公告)号：US20170301835A1
公开(公告)日：2017-10-19
申请号：US15515766
申请日：2015-10-01
发明人： Frank Singer , Britta Goeoetz , David Racz , Matthias Sperl
CPC分类号： H01L33/54 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/56 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/005
摘要： A method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device are disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips for producing electromagnetic radiation, arranging the plurality of semiconductor chips in a plane, forming a housing body composite, at least some regions of which are arranged between the semiconductor chips, forming a plurality of conversion elements, wherein each conversion element comprises a wavelength-converting conversion material and is arranged on one of the semiconductor chips, encapsulating the plurality of conversion elements at least on their lateral edges by an encapsulation material, and separating the housing body composite into a plurality of optoelectronic semiconductor components.
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8.发明申请公开(公告)号：US20170222105A1
公开(公告)日：2017-08-03
申请号：US15328601
申请日：2015-07-08
发明人： Matthias Sperl , Frank Singer
CPC分类号： H01L33/58 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： A semiconductor device includes a semiconductor chip including an active region provided to generate radiation; a radiation exit face extending parallel to a main plane of extension of the active region; a molding molded in places onto the semiconductor chip and that, at least in places, forms at least one side face of the semiconductor device; a mounting surface provided to mount the semiconductor device; and a spacer projecting beyond the radiation exit face in a vertical direction extending perpendicular to the radiation exit face.
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公开(公告)号：US11486819B2
公开(公告)日：2022-11-01
申请号：US16323504
申请日：2017-08-03
发明人： Frank Singer , Matthias Sperl
IPC分类号： G01N21/3504
摘要： A detection assembly and a method for producing a detection assemblies are disclosed. In an embodiment a detection arrangement includes an emitter configured to generate radiation having a peak wavelength in an infrared spectral range, a detector configured to receive the radiation, a mounting surface comprising at least a first contact surface and a second contact surface for external electrical connection of the detection arrangement, a form body adjoining the emitter and the detector at least in places and deflection optics, on which the radiation impinges during operation of the detection arrangement so that an optical path is formed between the emitter and the detector by the deflection optics, wherein the deflection optics include a scattering body into which the radiation enters during the operation through a surface of the scattering body facing the emitter.
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公开(公告)号：US10944033B2
公开(公告)日：2021-03-09
申请号：US16066552
申请日：2017-01-10
发明人： Luca Haiberger , David Racz , Matthias Sperl
IPC分类号： H01L33/00 , H01L33/62 , H01L31/024 , H01L33/64 , H01L31/0224 , H01L31/02 , H01L33/38 , H01L33/54 , H01L31/0304 , H01L31/0352 , H01L33/06 , H01L33/30
摘要： An optoelectronic component includes a radiation side, a contact side opposite a radiation side with at least two electrically conductive contact elements for external electrical contacting of the component, and a semiconductor layer sequence arranged between the radiation side and the contact side with an active layer that emits or absorbs electromagnetic radiation during normal operation, wherein the contact elements are spaced apart from each other at the contact side and are completely or partially exposed at the contact side in the unmounted state of the component, the region of the contact side between the contact elements is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in plan view of the contact side the cooling element covers one or both contact elements partially.
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