Invention Grant
- Patent Title: Circuit substrate, component-mounted substrate, and methods of manufacturing circuit substrate and component-mounted substrate
-
Application No.: US16583160Application Date: 2019-09-25
-
Publication No.: US10887988B2Publication Date: 2021-01-05
- Inventor: Masaaki Katsumata , Koji Taguchi , Norifumi Sasaoka , Yosuke Noda
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JP2018-180393 20180926
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/09 ; H01L33/62

Abstract:
A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.
Public/Granted literature
Information query