公开(公告)号：US11864317B2

公开(公告)日：2024-01-02

申请号：US17107953

申请日：2020-12-01

Applicant: NICHIA CORPORATION

Inventor： Masaaki Katsumata ,  Koji Taguchi ,  Norifumi Sasaoka ,  Yosuke Noda

IPC: H01L23/48 ,  H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H01L21/48

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49822 ,  H01L33/62 ,  H05K1/095 ,  H05K3/0094 ,  H05K3/4038 ,  H05K3/4069 ,  H01L2933/0066 ,  H05K1/112 ,  H05K2201/09454 ,  H05K2201/09572 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/1105

Abstract: A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

公开(公告)号：US12002907B2

公开(公告)日：2024-06-04

申请号：US17280047

申请日：2019-09-27

Applicant: NICHIA CORPORATION

Inventor： Yumiko Kameshima ,  Eiko Minato ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L24/96 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L33/56 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/96 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.

公开(公告)号：US11709310B2

公开(公告)日：2023-07-25

申请号：US17449200

申请日：2021-09-28

Applicant: NICHIA CORPORATION

Inventor： Koji Taguchi ,  Masaaki Katsumata

IPC: F21V8/00

CPC classification number: G02B6/0083 ,  G02B6/0021 ,  G02B6/0031 ,  G02B6/0068

Abstract: A surface-emitting light source includes: a wiring substrate including a wiring layer on a base member; a light-guiding plate having a first primary surface and a second primary surface facing the wiring substrate; a light-reflective resin portion having an opening and being disposed between the light-guiding plate and the wiring substrate; and a light source portion including an element electrode on a first surface thereof and a light-extracting surface on a second surface thereof that faces the light-guiding place. The element electrode is electrically connected to the wiring layer via the opening, which is equal to or smaller than an area in which a side surface of the light source portion contacts the resin portion. The resin portion and the light-guiding plate face each other and are bonded to each other, and the resin portion and the wiring substrate face each other and are bonded to each other.

公开(公告)号：US11363715B2

公开(公告)日：2022-06-14

申请号：US16583270

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.

公开(公告)号：US11324117B2

公开(公告)日：2022-05-03

申请号：US16583270

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.

公开(公告)号：US11616180B2

公开(公告)日：2023-03-28

申请号：US16854656

申请日：2020-04-21

Applicant: NICHIA CORPORATION

Inventor： Masaaki Katsumata ,  Koji Taguchi ,  Toshiaki Moriwaki

IPC: H01L33/62 ,  H01L33/00 ,  H01L23/00

Abstract: A light emitting device includes a base, a first external terminal, a second external terminal, a plurality of wirings respectively electrically connecting the first external terminal and the second external terminal, and a plurality of light emitting elements each electrically connected to a corresponding one of the wirings. The wirings include a first wiring connecting the first external terminal and the second external terminal at a smallest distance, a second wiring longer than the first wiring, and a third wiring longer than the second wiring. The first, second, and third wirings have a substantially equal electric resistance. At least two of the first, second and third wirings are each provided with at least two of the light emitting elements with an average width in an intermediate region between adjacent ones of the light emitting elements being smaller than an average width in a region other than the intermediate region.

公开(公告)号：US11611014B2

公开(公告)日：2023-03-21

申请号：US17580193

申请日：2022-01-20

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24 ,  H01L33/62

Abstract: A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

公开(公告)号：US11437554B2

公开(公告)日：2022-09-06

申请号：US16849383

申请日：2020-04-15

Applicant: NICHIA CORPORATION

Inventor： Koji Taguchi ,  Masaaki Katsumata

IPC: H01L33/62 ,  H01L33/58 ,  H01L25/075

Abstract: A light emitting module includes a first terminal part, a first light emitting device including a first electrode, a second light emitting device including a second electrode, a first conductive thin film including a first thin film region and a second thin film region, and a first conductive layer electrically connected to the first thin film region. The first thin film region electrically connects the first terminal part and the first electrode, and has a first current path length. The second thin film region electrically connects the first terminal part and the second electrode, and has a second current path length shorter than the first current path length. At least a portion of the first conductive layer overlaps with the first thin film region in a first direction that is perpendicular to a plane in which the first thin film region extends.

公开(公告)号：US10887988B2

公开(公告)日：2021-01-05

申请号：US16583160

申请日：2019-09-25

Applicant: NICHIA CORPORATION

Inventor： Masaaki Katsumata ,  Koji Taguchi ,  Norifumi Sasaoka ,  Yosuke Noda

IPC: H05K1/11 ,  H05K1/09 ,  H01L33/62

Abstract: A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

公开(公告)号：US11605619B2

公开(公告)日：2023-03-14

申请号：US17186918

申请日：2021-02-26

Applicant: NICHIA CORPORATION

Inventor： Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L25/13 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58

Abstract: A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.