Invention Grant
- Patent Title: Rheology modifiers for encapsulating quantum dots
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Application No.: US16078878Application Date: 2017-05-12
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Publication No.: US10889675B2Publication Date: 2021-01-12
- Inventor: Zhifeng Bai , Jake Joo , James C. Taylor , Liang Chen , Valeriy V. Ginzburg , Jessica Ye Huang , Christopher J. Tucker
- Applicant: Dow Global Technologies LLC , Rohm and Haas Electronic Materials LLC
- Applicant Address: US MI Midland; US MA Marlborough
- Assignee: Dow Global Technologies LLC,Rohm and Haas Electronic Materials LLC
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MI Midland; US MA Marlborough
- Agent G. Creston Campbell
- International Application: PCT/US2017/032311 WO 20170512
- International Announcement: WO2017/205079 WO 20171130
- Main IPC: B82Y20/00
- IPC: B82Y20/00 ; B82Y40/00 ; C08F287/00 ; C08F292/00 ; C09K11/02 ; C08K5/10 ; C08K3/08 ; B82Y30/00

Abstract:
A polymer resin comprising: (a) quantum dots, (b) a compound of formula (I) (I) wherein R1 is hydrogen or methyl and R2 is a C6-C20 aliphatic polycyclic substituent, and (c) a block or graft copolymer having Mn from 50,000 to 400,000 and comprising from 10 to 100 wt % polymerized units of styrene and from 0 to 90 wt % of a non-styrene block; wherein the non-styrene block has a van Krevelen solubility parameter from 15.0 to 17.5 (J/cm3)1/2.
Public/Granted literature
- US20190085112A1 RHEOLOGY MODIFIERS FOR ENCAPSULATING QUANTUM DOTS Public/Granted day:2019-03-21
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