Invention Grant
- Patent Title: Memory modules and memory systems including a power management integrated circuit
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Application No.: US16552506Application Date: 2019-08-27
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Publication No.: US10891988B2Publication Date: 2021-01-12
- Inventor: Hwan-Wook Park , Yong-Jin Kim , Jin-Seong Yun , Kyu-Dong Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2017-0133117 20171013
- Main IPC: G11C5/14
- IPC: G11C5/14 ; G11C5/06 ; G11C11/4074 ; G11C5/04

Abstract:
A memory module includes a circuit board, a plurality of memory devices, and a power management integrated circuit (PMIC). The circuit board includes first connectors, a second connector, and a third connector connected to an external device. The plurality of memory devices are mounted on the circuit board, and connected to the first connectors. The PMIC receives a first voltage through the second connector, generates a second voltage using the first voltage, and provides the second voltage to the plurality of memory devices The PMIC adjusts the second voltage based on a signal received through the third connector such that a voltage difference of the first voltage and the second voltage is reduced in a training mode of the memory module.
Public/Granted literature
- US20190385645A1 MEMORY MODULES AND MEMORY SYSTEMS INCLUDING THE SAME Public/Granted day:2019-12-19
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