Invention Grant
- Patent Title: Non-planar I/O and logic semiconductor devices having different workfunction on common substrate
-
Application No.: US15930700Application Date: 2020-05-13
-
Publication No.: US10892192B2Publication Date: 2021-01-12
- Inventor: Roman W. Olac-Vaw , Walid M. Hafez , Chia-Hong Jan , Pei-Chi Liu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L21/8234 ; H01L27/12 ; H01L21/84 ; H01L21/28 ; H01L23/528 ; H01L29/49 ; H01L21/8238 ; H01L29/66

Abstract:
Non-planar I/O and logic semiconductor devices having different workfunctions on common substrates and methods of fabricating non-planar I/O and logic semiconductor devices having different workfunctions on common substrates are described. For example, a semiconductor structure includes a first semiconductor device disposed above a substrate. The first semiconductor device has a conductivity type and includes a gate electrode having a first workfunction. The semiconductor structure also includes a second semiconductor device disposed above the substrate. The second semiconductor device has the conductivity type and includes a gate electrode having a second, different, workfunction.
Public/Granted literature
- US20200273752A1 NON-PLANAR I/O AND LOGIC SEMICONDUCTOR DEVICES HAVING DIFFERENT WORKFUNCTION ON COMMON SUBSTRATE Public/Granted day:2020-08-27
Information query
IPC分类: