Invention Grant
- Patent Title: Micro-LED transfer method, manufacturing method and device
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Application No.: US16320019Application Date: 2016-08-22
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Publication No.: US10896927B2Publication Date: 2021-01-19
- Inventor: Quanbo Zou , Peixuan Chen , Xiangxu Feng
- Applicant: GOERTEK INC.
- Applicant Address: CN Weifang
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: CN Weifang
- Agency: Saliwanchik, Lloyd & Eisenschenk
- International Application: PCT/CN2016/096197 WO 20160822
- International Announcement: WO2018/035668 WO 20180301
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/62 ; H01L33/60 ; H01L33/00 ; H01L25/075

Abstract:
A micro-LED transfer method, manufacturing method and device are provided. The micro-LED transfer method comprises: obtaining a laser-transparent carrier substrate having a first surface and a second surface with micro-LEDs; forming a protection layer on at least one of the first surface and the second surface and a third surface of a receiving substrate, wherein the third surface is to receive the micro-LEDs to be transferred via pads; bringing the micro-LEDs to be transferred into contact with the pads on the third surface; and irradiating the micro-LEDs to be transferred with laser from the first surface to lift-off the micro-LEDs to be transferred from the carrier substrate wherein the protection layer configured to protect the third surface from the irradiation of the laser.
Public/Granted literature
- US20190267426A1 MICRO-LED TRANSFER METHOD, MANUFACTURING METHOD AND DEVICE Public/Granted day:2019-08-29
Information query
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