- 专利标题: Gas enclosure assembly and system
-
申请号: US16362595申请日: 2019-03-22
-
公开(公告)号: US10900678B2公开(公告)日: 2021-01-26
- 发明人: Justin Mauck , Alexander Sou-Kang Ko , Eliyahu Vronsky , Shandon Alderson
- 申请人: Kateeva, Inc.
- 申请人地址: US CA Newark
- 专利权人: Kateeva, Inc.
- 当前专利权人: Kateeva, Inc.
- 当前专利权人地址: US CA Newark
- 代理机构: Hauptman Ham, LLP
- 主分类号: F24F3/16
- IPC分类号: F24F3/16 ; B41J29/393 ; H05B33/10 ; H01L51/56 ; F24F3/14 ; B05B17/00 ; H01L51/00 ; B41J29/377 ; H05B33/02
摘要:
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
公开/授权文献
- US20190219285A1 Gas Enclosure Assembly and System 公开/授权日:2019-07-18
信息查询