Invention Grant
- Patent Title: Self-aligned internal spacer with EUV
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Application No.: US16408971Application Date: 2019-05-10
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Publication No.: US10903335B2Publication Date: 2021-01-26
- Inventor: Gaspard Hiblot , Sylvain Baudot , Hans Mertens , Julien Jussot
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP18171948 20180511
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L21/306 ; H01L29/06 ; H01L29/786 ; H01L29/775 ; H01L29/40 ; H01L29/78 ; H01L29/423

Abstract:
A method of forming aligned gates for horizontal nanowires or nanosheets, comprising: providing a wafer which comprises at least one fin of sacrificial layers alternated with functional layers, and a dummy gate covering a section of the fin between a first end and a second end; at least partly removing the sacrificial layers at the first end and the second end thereby forming a void between the functional layers at the first and end such that the void is partly covered by the dummy gate; providing resist material which oxidizes upon EUV exposure; exposing the wafer to EUV light; selectively removing the dummy gate and the unexposed resist; forming a gate between the functional layers and between the exposed resist at the first end and at the second end.
Information query
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