Invention Grant
- Patent Title: Electronic package
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Application No.: US16192262Application Date: 2018-11-15
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Publication No.: US10903547B2Publication Date: 2021-01-26
- Inventor: Ying-Wei Lu , Bo-Siang Fang , Kuan-Ta Chen
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW107117524A 20180523
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/04 ; H01Q1/38 ; H01L23/66

Abstract:
An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.
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