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公开(公告)号：US20200304165A1
公开(公告)日：2020-09-24
申请号：US16843386
申请日：2020-04-08
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Bo-Siang Fang , Kuan-Ta Chen , Ying-Wei Lu , Chia-Chu Lai , Cheng-Tsai Hsieh
IPC: H04B1/48 , H04B1/7085 , G01S13/40 , H04B1/04 , G01S13/32
Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.
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公开(公告)号：US20190319347A1
公开(公告)日：2019-10-17
申请号：US16044154
申请日：2018-07-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Bo-Siang Fang , Kuan-Ta Chen , Chia-Chu Lai , Ying-Wei Lu
IPC: H01Q1/38 , H01Q1/40 , H01L23/552 , H01L23/31 , H01L23/66
Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.
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公开(公告)号：US09999132B2
公开(公告)日：2018-06-12
申请号：US15163045
申请日：2016-05-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chia-Yang Chen , Ying-Wei Lu , Jyun-Yuan Jhang , Ming-Fan Tsai
CPC classification number: H05K1/185 , G06K19/07777 , H01L25/00 , H01L2224/16225 , H01L2224/48091 , H01L2924/1815 , H05K1/165 , H05K1/186 , H05K3/0014 , H05K3/107 , H05K3/207 , H05K3/4602 , H05K3/465 , H05K2201/09118 , H05K2201/10098 , H05K2203/1327 , H01L2924/00014
Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.
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公开(公告)号：US20170201023A1
公开(公告)日：2017-07-13
申请号：US15083421
申请日：2016-03-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chia-Yang Chen , Ying-Wei Lu , Jyun-Yuan Jhang , Ming-Fan Tsai
IPC: H01Q9/04 , H01L23/498 , H01L23/66 , H01Q1/24 , H01Q1/48
CPC classification number: H01L23/49838 , H01L23/66 , H01L2223/6627 , H01L2223/6677 , H01Q1/243 , H01Q9/065 , H01Q19/104 , H01Q23/00
Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.
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公开(公告)号：US20210013583A1
公开(公告)日：2021-01-14
申请号：US16554952
申请日：2019-08-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Ying-Wei Lu , Bo-Siang Fang , Kuan-Ta Chen , Chia-Chu Lai
IPC: H01Q1/22
Abstract: An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
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Patent Agency Ranking
公开(公告)号：US10199317B2
公开(公告)日：2019-02-05
申请号：US15083421
申请日：2016-03-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chia-Yang Chen , Ying-Wei Lu , Jyun-Yuan Jhang , Ming-Fan Tsai
Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.
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公开(公告)号：US20160240302A1
公开(公告)日：2016-08-18
申请号：US14981184
申请日：2015-12-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Ming-Fan Tsai , Ho-Chuan Lin , Ying-Wei Lu
CPC classification number: H01F17/0006 , H01F1/24 , H01F2017/0046 , H01F2017/0066 , H01F2017/0073
Abstract: A substrate structure is provided, which includes: a first dielectric layer having a magnetic material; a circuit layer having an inductor circuit and a plurality of conductive traces; and a second dielectric layer bonded to the first dielectric layer and encapsulating the circuit layer. As such, the inductance value of the inductor circuit is increased due to the magnetic material of the first dielectric layer, thereby eliminating the need to increase the number of coils of the inductor circuit.
Abstract translation: 提供一种基板结构，其包括：具有磁性材料的第一介电层; 具有电感器电路和多个导电迹线的电路层; 以及结合到第一介电层并封装电路层的第二电介质层。 因此，由于第一介电层的磁性材料，电感电路的电感值增加，从而不需要增加电感器电路的线圈数。
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公开(公告)号：US11081776B2
公开(公告)日：2021-08-03
申请号：US16554952
申请日：2019-08-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Ying-Wei Lu , Bo-Siang Fang , Kuan-Ta Chen , Chia-Chu Lai
IPC: H01Q1/22
Abstract: An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
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公开(公告)号：US10903547B2
公开(公告)日：2021-01-26
申请号：US16192262
申请日：2018-11-15
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Ying-Wei Lu , Bo-Siang Fang , Kuan-Ta Chen
Abstract: An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.
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公开(公告)号：US20200072886A1
公开(公告)日：2020-03-05
申请号：US16408389
申请日：2019-05-09
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Bo-Siang Fang , Cheng-Tsai Hsieh , Kuan-Ta Chen , Ying-Wei Lu
Abstract: A testing fixture used in an antenna testing process is provided. A cover unit having a second antenna portion is arranged on a base unit configured for an electronic structure having a first antenna portion to be placed thereon. The cover unit includes a non-metal interposing portion configured for pressing the electronic structure to separate the second antenna portion from the first antenna portion. Therefore, when the antenna testing process is performed on the electronic structure, a metal shielding effect is avoided, and an over the air testing environment is provided.
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