Method of adhesively bonding two surfaces by means of a reactive adhesive film system comprising at least two adhesive films (F1 and F2), each comprising at least one reactive component (R1 and R2), adhesive bonding being effected by a reaction which requires the presence of both reactive components (R1 and R2),
wherein, prior to adhesive bonding, a separating layer (T) which is impermeable to the reactive components is provided between the adhesive films which are to be brought into contact with one another for the reaction,
and the separating layer (T) is removed at least in part by means of a laser in order to effect bonding,
so that the adhesive films (F1 and F2) come into direct contact with one another and the reaction begins in the presence of both reactive components (R1 and R2), and reactive adhesive film system for use in this method.