- 专利标题： Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium
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申请号： US16401760申请日： 2019-05-02
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公开(公告)号： US10910334B2公开(公告)日： 2021-02-02
- 发明人: Takahisa Okuzono , Masaki Tomita , Jumpei Fujikata
- 申请人： EBARA CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权： JP2018-092546 20180511
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/66 ; G06T7/00 ; G06K9/62
摘要：
A device for inspecting a bump height includes an illumination device, an imaging device, and a control device. The illumination device irradiates a substrate with light. The substrate includes a resist and a bump formed on an opening portion of the resist. The imaging device images a pattern of the resist and the bump. The control device evaluates a height of the bump based on a luminance value of image data of the pattern obtained by the imaging device.
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