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公开(公告)号：US11359304B2
公开(公告)日：2022-06-14
申请号：US16234299
申请日：2018-12-27
Applicant: EBARA CORPORATION
Inventor： Shao Hua Chang , Jumpei Fujikata
Abstract: There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.
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公开(公告)号：US20210262111A1
公开(公告)日：2021-08-26
申请号：US17177500
申请日：2021-02-17
Applicant: EBARA CORPORATION
Inventor： Yasuyuki Masuda , Shao Hua Chang , Yoshitaka Mukaiyama , Masashi Shimoyama , Jumpei Fujikata
Abstract: A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.
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公开(公告)号：US20210154629A1
公开(公告)日：2021-05-27
申请号：US17169130
申请日：2021-02-05
Applicant: EBARA CORPORATION
Inventor： Yasuyuki Masuda , Masashi Shimoyama , Jumpei Fujikata , Yohei Wakuda , Shao Hua Chang
Abstract: A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.
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公开(公告)号：US10676838B2
公开(公告)日：2020-06-09
申请号：US15878267
申请日：2018-01-23
Applicant: EBARA CORPORATION
Inventor： Mizuki Nagai , Kazuhito Tsuji , Takashi Kishi , Toshiki Miyakawa , Masashi Shimoyama , Jumpei Fujikata
Abstract: A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.
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公开(公告)号：US10119198B2
公开(公告)日：2018-11-06
申请号：US15163588
申请日：2016-05-24
Applicant: EBARA CORPORATION
Inventor： Jumpei Fujikata , Masashi Shimoyama
Abstract: A method of cleaning a substrate holder comprises suspending the substrate holder in a substrate holder cleaning bath while the substrate holder holds a dummy substrate with a sealing member sealing a peripheral portion of the dummy substrate. The dummy substrate has a larger area of contact with a substrate contact portion of the sealing member and has a larger area of contact with a substrate contact portion of an electrical contact of the substrate holder than those of a substrate to be plated. The method further comprises supplying a cleaning liquid into the substrate holder cleaning bath until the substrate holder is immersed in the cleaning liquid to clean the substrate holder. Different types of cleaning liquids are individually and sequentially supplied into the substrate holder cleaning bath to clean the substrate holder sequentially with the cleaning liquids.
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Patent Agency Ranking
公开(公告)号：US10113246B2
公开(公告)日：2018-10-30
申请号：US15116197
申请日：2015-01-29
Applicant: EBARA CORPORATION
Inventor： Jumpei Fujikata , Yoshio Minami
Abstract: A substrate holder includes: inner contacts (45) to be brought into contact with a periphery of a substrate (W) for passing an electric current to the substrate; outer contacts (42) each having elasticity, the outer contacts (42) having contact surfaces (42a), respectively, to be brought into contact with a feeding terminal (51) coupled to a power source (18), the outer contacts (42) being coupled to the inner contacts (45), respectively; and a conductive block (60) arranged in back of the contact surfaces (42a) and located away from the outer contacts (42). The outer contacts (42) are deformable until the outer contacts (42) are brought into contact with the conductive block (60) when the contact surfaces (42a) are pressed against the feeding terminal (51).
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公开(公告)号：USD705280S1
公开(公告)日：2014-05-20
申请号：US29460477
申请日：2013-07-11
Applicant: Ebara Corporation
Designer： Masaaki Kimura , Mitsutoshi Yahagi , Jumpei Fujikata
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公开(公告)号：US12116687B2
公开(公告)日：2024-10-15
申请号：US17722879
申请日：2022-04-18
Applicant: EBARA CORPORATION
Inventor： Shao Hua Chang , Jumpei Fujikata
Abstract: There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.
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公开(公告)号：US11385125B2
公开(公告)日：2022-07-12
申请号：US16711983
申请日：2019-12-12
Applicant: EBARA CORPORATION
Inventor： Kiyoshi Suzuki , Jumpei Fujikata
Abstract: A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.
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公开(公告)号：US20180179656A1
公开(公告)日：2018-06-28
申请号：US15849371
申请日：2017-12-20
Applicant: Ebara Corporation
Inventor： Takahisa Okuzono , Jumpei Fujikata
CPC classification number: C25D5/34 , C23C18/163 , C23C18/1827 , C25D17/001 , C25D17/004 , C25D17/06 , C25D21/08 , C25D21/12
Abstract: A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.
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