Invention Grant
- Patent Title: Multicolor approach to DRAM STI active cut patterning
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Application No.: US16527915Application Date: 2019-07-31
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Publication No.: US10910381B2Publication Date: 2021-02-02
- Inventor: Tejinder Singh , Takehito Koshizawa , Abhijit Basu Mallick , Pramit Manna , Nancy Fung , Eswaranand Venkatasubramanian , Ho-yung David Hwang , Samuel E. Gottheim
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L27/10
- IPC: H01L27/10 ; H01L21/02 ; H01L27/108
Abstract:
Apparatuses and methods to provide a patterned substrate are described. A plurality of patterned and spaced first lines and carbon material lines and formed on the substrate surface by selectively depositing and etching films extending in a first direction and films extending in a second direction that crosses the first direction to pattern the underlying structures.
Public/Granted literature
- US20200043932A1 Multicolor Approach To DRAM STI Active Cut Patterning Public/Granted day:2020-02-06
Information query
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