Invention Grant
- Patent Title: Correlating SEM and optical images for wafer noise nuisance identification
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Application No.: US16886255Application Date: 2020-05-28
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Publication No.: US10921262B2Publication Date: 2021-02-16
- Inventor: Qiang Zhang , Grace H. Chen
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Kwan & Olynick LLP
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/95 ; G06T7/00 ; G06T7/174 ; G06T7/11 ; G01N23/2251 ; G01N21/956

Abstract:
Disclosed are apparatus and methods for inspecting a sample. Locations corresponding to candidate defect events on a sample are provided from an inspector operable to acquire optical images from which such candidate defect events are detected at their corresponding locations across the sample. High-resolution images are acquired from a high-resolution inspector of the candidate defect events at their corresponding locations on the sample. Each of a set of modelled optical images, which have been modeled from a set of the acquired high-resolution images, is correlated with corresponding ones of a set of the acquired optical images, to identify surface noise events, as shown in the set of high-resolution images, as sources for the corresponding candidate events in the set of acquired optical images. Otherwise, a subsurface event is identified as a likely source for a corresponding candidate defect event.
Public/Granted literature
- US20200292468A1 CORRELATING SEM AND OPTICAL IMAGES FOR WAFER NOISE NUISANCE IDENTIFICATION Public/Granted day:2020-09-17
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