Invention Grant
- Patent Title: Piezoelectric package-integrated current sensing devices
-
Application No.: US16096968Application Date: 2016-07-01
-
Publication No.: US10921349B2Publication Date: 2021-02-16
- Inventor: Georgios C. Dogiamis , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Jelena Culic-Viskota , Thomas L. Sounart , Feras Eid , Sasha N. Oster
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/040844 WO 20160701
- International Announcement: WO2018/004689 WO 20180104
- Main IPC: G01R15/20
- IPC: G01R15/20 ; H01L41/06 ; G01R15/14 ; H01L41/113 ; G01R15/24 ; H01L41/12

Abstract:
Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.
Public/Granted literature
- US20190113545A1 PIEZOELECTRIC PACKAGE-INTEGRATED CURRENT SENSING DEVICES Public/Granted day:2019-04-18
Information query