Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
-
Application No.: US16438067Application Date: 2019-06-11
-
Publication No.: US10921514B2Publication Date: 2021-02-16
- Inventor: Tetsuya Iida , Yasutaka Nakashiba
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2018-118990 20180622
- Main IPC: G02B6/036
- IPC: G02B6/036 ; G02B6/42 ; G02B6/30 ; G02B6/32 ; G02B6/125
Abstract:
The semiconductor device includes an optical waveguide WG1 formed in a planar manner, and a three-dimensional optical waveguide WG2 optically connected with the optical waveguide WG1 and including a curved shape.
Public/Granted literature
- US20190391325A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2019-12-26
Information query
