- Patent Title: Systems, methods, and apparatuses for implementing bi-layer semiconducting oxides in source and drain for low access and contact resistance of thin film transistors
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Application No.: US16325164Application Date: 2016-09-30
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Publication No.: US10930791B2Publication Date: 2021-02-23
- Inventor: Gilbert Dewey , Van H. Le , Rafael Rios , Shriram Shivaraman , Jack T. Kavalieros , Marko Radosavljevic
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/054841 WO 20160930
- International Announcement: WO2018/063343 WO 20180405
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/786 ; H01L29/221 ; H01L29/66

Abstract:
In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing bi-layer semiconducting oxides in a source/drain for low access and contact resistance of thin film transistors. For instance, there is disclosed in accordance with one embodiment a semiconductor device having therein a substrate; a bi-layer oxides layer formed from a first oxide material and a second oxide material, the first oxide material comprising a semiconducting oxide material and having different material properties from the second oxide material comprising a high mobility oxide material; a channel layer formed atop the substrate, the channel layer formed from the semiconducting oxide material of the bi-layer oxides layer; a high mobility oxide layer formed atop the channel layer, the high conductivity oxide layer formed from the high mobility oxide material of the bi-layer oxides layer; metallic contacts formed atop the high mobility oxide layer; a gate and a gate oxide material formed atop the high mobility oxide layer, the gate oxide material being in direct contact with the high mobility oxide layer; and spacers separating the metallic contacts from the gate and gate oxide material. Other related embodiments are disclosed.
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