Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16783577Application Date: 2020-02-06
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Publication No.: US10930792B2Publication Date: 2021-02-23
- Inventor: Shunpei Yamazaki , Hidekazu Miyairi , Akiharu Miyanaga , Kengo Akimoto , Kojiro Shiraishi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2008-197137 20080731
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/423 ; H01L29/66 ; H01L27/12

Abstract:
To offer a semiconductor device including a thin film transistor having excellent characteristics and high reliability and a method for manufacturing the semiconductor device without variation. The summary is to include an inverted-staggered (bottom-gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used for a semiconductor layer and a buffer layer is provided between the semiconductor layer and source and drain electrode layers. An ohmic contact is formed by intentionally providing a buffer layer containing In, Ga, and Zn and having a higher carrier concentration than the semiconductor layer between the semiconductor layer and the source and drain electrode layers.
Public/Granted literature
- US20200176606A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-06-04
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