Invention Grant
- Patent Title: Component redundancy systems, devices, and methods
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Application No.: US15465247Application Date: 2017-03-21
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Publication No.: US10936449B2Publication Date: 2021-03-02
- Inventor: Hang T. Nguyen , Stephen T. Palermo , John J. Browne , Chris MacNamara , Pradeepsunder Ganesh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/20 ; G06F3/06 ; G06F11/30

Abstract:
Discussed herein are component redundancy systems, devices, and methods. A method to transfer a workload from a first component to a second component of a same device may include monitoring a wear indicator associated with the first component, and in response to an indication that the first component is stressed based on the wear indicator, transferring a workload of the first component to the second component.
Public/Granted literature
- US20180275893A1 COMPONENT REDUNDANCY SYSTEMS, DEVICES, AND METHODS Public/Granted day:2018-09-27
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