Invention Grant
- Patent Title: Bushing with integrated electronics
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Application No.: US16470257Application Date: 2017-12-19
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Publication No.: US10937571B2Publication Date: 2021-03-02
- Inventor: Ranjit Jadhav , Arend Lammers , Rahul Pingale , Amritendu Das
- Applicant: Eaton Intelligent Power Limited
- Applicant Address: IE Dublin
- Assignee: Eaton Intelligent Power Limited
- Current Assignee: Eaton Intelligent Power Limited
- Current Assignee Address: IE Dublin
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: IN201611043504 20161220
- International Application: PCT/EP2017/083664 WO 20171219
- International Announcement: WO2018/115027 WO 20180628
- Main IPC: H01B17/00
- IPC: H01B17/00 ; H01B17/26 ; H01F27/04 ; H01R4/64 ; H01R13/66

Abstract:
A bushing includes: an elongate electrical conductor; an insulation layer arranged around the elongate electrical conductor; an electrically conducting sleeve coaxially arranged with the electrical conductor; and a ring shaped printed circuit board with electrical components coaxially arranged around the electrical conductor. The sleeve and the printed circuit board are embedded in the insulation layer. The ring shaped printed circuit board is positioned in an axial direction between both ends of the electrically conducting sleeve.
Public/Granted literature
- US20200082961A1 BUSHING WITH INTEGRATED ELECTRONICS Public/Granted day:2020-03-12
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