A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.