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    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE
    1.
    发明申请
    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE 审中-公开
    提供多芯片封装的热参数报告的装置和方法

    公开(公告)号：US20160179158A1

    公开(公告)日：2016-06-23

    申请号：US14852859

    申请日：2015-09-14

    Applicant: Intel Corporation

    Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

    IPC: G06F1/26 ,  G06F1/18 ,  G06F1/20 ,  G06F1/32

    CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F3/0412 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

    Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中，处理器包括至少一个核心和电源管理逻辑。 电源管理逻辑用于从包括处理器的封装内的多个管芯接收温度数据，并且确定多个温度控制裕度的最小温度控制裕度。 每个温度控制余量将基于与管芯相关联的相应的热控制温度并且还基于与管芯相关联的相应的温度数据来确定。 电源管理逻辑还可以生成包含最小温度控制余量的热报告，并存储热报告。 描述和要求保护其他实施例。

    Determining thermal margins in a multi-die processor
    6.
    发明授权
    Determining thermal margins in a multi-die processor 有权

    公开(公告)号：US10908660B2

    公开(公告)日：2021-02-02

    申请号：US16353083

    申请日：2019-03-14

    Applicant: Intel Corporation

    Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

    IPC: G06F1/32 ,  G06F1/20 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  G06F1/3234 ,  G01K3/08

    Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

    Determining thermal margins in a multi-die processor
    7.
    发明授权
    Determining thermal margins in a multi-die processor 有权

    公开(公告)号：US10248173B2

    公开(公告)日：2019-04-02

    申请号：US15086387

    申请日：2016-03-31

    Applicant: Intel Corporation

    Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

    IPC: G06F1/20 ,  G06F1/32 ,  G06F1/3203 ,  G01K3/08

    Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

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