Invention Grant
- Patent Title: Etchant composition and method of manufacturing wiring substrate using the same
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Application No.: US16505712Application Date: 2019-07-09
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Publication No.: US10941342B2Publication Date: 2021-03-09
- Inventor: Bong Kyun Kim , Jin Suek Kim , Seung Bo Shim , Shin Hyuk Choi , Seung Hee Kim , Dong Hee Lee , In Seol Kuk , Beom Soo Kim , Sang Tae Kim , Young Chul Park , Young Jin Yoon , Dae Sung Lim
- Applicant: Samsung Display Co., Ltd. , DONGWOO FINE-CHEM CO., LTD.
- Applicant Address: KR Yongin-si; KR Iksan-si
- Assignee: Samsung Display Co., Ltd.,DONGWOO FINE-CHEM CO., LTD.
- Current Assignee: Samsung Display Co., Ltd.,DONGWOO FINE-CHEM CO., LTD.
- Current Assignee Address: KR Yongin-si; KR Iksan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2018-0085320 20180723
- Main IPC: C09K13/06
- IPC: C09K13/06 ; C09K13/12

Abstract:
An etchant composition may include: a peroxosulfate; a cyclic amine compound; a first amphoteric compound including a carboxyl group; and a second amphoteric compound including a sulfone group, wherein the second amphoteric compound may be different from the first amphoteric compound.
Public/Granted literature
- US20200024516A1 ETCHANT COMPOSITION AND METHOD OF MANUFACTURING WIRING SUBSTRATE USING THE SAME Public/Granted day:2020-01-23
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