Invention Grant
- Patent Title: Semiconductor package
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Application No.: US16244661Application Date: 2019-01-10
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Publication No.: US10943881B2Publication Date: 2021-03-09
- Inventor: Ae-nee Jang , KyungSeon Hwang , SunWon Kang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, PC
- Priority: KR10-2015-0183052 20151221
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00 ; H01L21/56 ; H01L23/48

Abstract:
A semiconductor package includes a substrate, through-electrodes penetrating the substrate, first bumps spaced apart from each other in a first direction parallel to a top surface of the substrate and electrically connected to the through-electrodes, respectively, and at least one second bump disposed between the first bumps and electrically insulated from the through-electrodes. The first bumps and the at least one second bump constitute one row in the first direction. A level of a bottom surface of the at least one second bump from the top surface of the substrate is a substantially same as levels of bottom surfaces of the first bumps from the top surface of the substrate.
Public/Granted literature
- US20190164922A1 SEMICONDUCTOR PACKAGE Public/Granted day:2019-05-30
Information query
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