Invention Grant
- Patent Title: Image sensor and manufacturing method thereof
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Application No.: US16231958Application Date: 2018-12-25
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Publication No.: US10943938B2Publication Date: 2021-03-09
- Inventor: Chia-Wen Chiang , Hsiang-Hung Chang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107143943A 20181206
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0232 ; H04N5/225

Abstract:
An image sensor including a substrate and an image sensing element is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit a contour of the arc surface. The image sensing element has a front surface and a rear surface opposite to each other and has at least one first conductive via. The rear surface of the image sensing element directly contacts the arc surface, and the first conductive via is extended from the front surface to the rear surface. In addition, a manufacturing method of the image sensor is also provided.
Public/Granted literature
- US20200185444A1 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-06-11
Information query
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