Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.