Invention Grant
- Patent Title: Self-aligned contact and method for forming the same
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Application No.: US16175556Application Date: 2018-10-30
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Publication No.: US10957589B2Publication Date: 2021-03-23
- Inventor: Hsien-Hsin Lin
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L27/105
- IPC: H01L27/105 ; H01L21/768 ; H01L21/311 ; H01L29/66 ; H01L21/033

Abstract:
A method for forming a self-aligned contact includes providing a substrate with a plurality of gate structures including spacers on opposite sides. The method also includes forming a sacrificial layer between the gate structures. The method also includes forming a mask layer on a part of the sacrificial layer. The method also includes forming a plurality of first openings by removing the sacrificial layer exposed from the mask layer. The method also includes forming a dielectric layer in the plurality of first openings. The method also includes removing the mask layer. The method also includes forming a plurality of second openings by removing the sacrificial layer that remains on the substrate. The method also includes forming a plurality of first contact plugs in the second openings.
Public/Granted literature
- US20190164830A1 SELF-ALIGNED CONTACT AND METHOD FOR FORMING THE SAME Public/Granted day:2019-05-30
Information query
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