Invention Grant
- Patent Title: Curable composition, thermally conductive material, and device with thermally conductive layer
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Application No.: US16533816Application Date: 2019-08-07
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Publication No.: US10961423B2Publication Date: 2021-03-30
- Inventor: Seiichi Hitomi , Keita Takahashi
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2017-022318 20170209
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08J5/18 ; C08L35/02 ; H01L23/373

Abstract:
A first object of the present invention is to provide a curable composition capable of providing a cured substance in which an inorganic substance exhibits excellent dispersibility and which exhibits high thermal conductivity. A second object of the present invention is to provide a thermally conductive material formed by curing the curable composition and a device with a thermally conductive layer including the thermally conductive material.
The curable composition according to an embodiment of the present invention contains an inorganic substance selected from the group consisting of an inorganic nitride and an inorganic oxide, a compound which has a monovalent substituent selected from the group consisting of a boronic acid group, a boronic acid ester group, an aldehyde group, and a pyridinium group and has a molecular weight equal to or greater than 1,000, and a polymerizable monomer.
The curable composition according to an embodiment of the present invention contains an inorganic substance selected from the group consisting of an inorganic nitride and an inorganic oxide, a compound which has a monovalent substituent selected from the group consisting of a boronic acid group, a boronic acid ester group, an aldehyde group, and a pyridinium group and has a molecular weight equal to or greater than 1,000, and a polymerizable monomer.
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