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    Surface-modified inorganic nitride, composition, thermally conductive material, and device with thermally conductive layer
    6.
    发明授权
    Surface-modified inorganic nitride, composition, thermally conductive material, and device with thermally conductive layer 有权

    公开(公告)号：US11370950B2

    公开(公告)日：2022-06-28

    申请号：US16735789

    申请日：2020-01-07

    申请人： FUJIFILM Corporation

    发明人： Seiichi Hitomi ,  Keita Takahashi ,  Naoyuki Hayashi ,  Teruki Niori ,  Daisuke Hayashi

    IPC分类号： C09K5/14 ,  C08K3/38 ,  C08K9/04 ,  C09C1/00 ,  C09C3/08 ,  H01L23/373

    摘要： A first object of the present invention is to provide a surface-modified inorganic nitride having excellent dispersibility. Furthermore, a second object of the present invention is to provide a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride.
    The surface-modified inorganic nitride of the present invention includes an inorganic nitride, and a specific compound adsorbed onto a surface of the inorganic nitride, and
    the specific compound has a functional group selected from the group consisting of a boronic acid group, an aldehyde group, an isocyanate group, an isothiocyanate group, a cyanate group, an acyl azide group, a succinimide group, a sulfonyl chloride group, a carboxylic acid chloride group, an onium group, a carbonate group, an aryl halide group, a carbodiimide group, an acid anhydride group, a carboxylic acid group, a phosphonic acid group, a phosphinic acid group, a phosphoric acid group, a phosphoric acid ester group, a sulfonic acid group, a halogenated alkyl group, a nitrile group, a nitro group, an ester group, a carbonyl group, an imidoester group, an alkoxysilyl group, an acrylic group, a methacrylic group, an oxetanyl group, a vinyl group, an alkynyl group, a maleimide group, a thiol group, a hydroxyl group, a halogen atom, and an amino group, and has a fused-ring structure containing two or more rings selected from the group consisting of an aromatic hydrocarbon ring and an aromatic heterocyclic ring.

    Thermally conductive material, resin composition, and device
    9.
    发明授权
    Thermally conductive material, resin composition, and device 有权

    公开(公告)号：US10774212B2

    公开(公告)日：2020-09-15

    申请号：US16045711

    申请日：2018-07-25

    申请人： FUJIFILM Corporation

    发明人： Keita Takahashi

    IPC分类号： C08L63/00 ,  C08G59/20 ,  C08L101/00 ,  C09K5/14 ,  C08K3/38 ,  C08L33/06 ,  C08K3/28 ,  C08K9/04 ,  C08L33/10 ,  C08L33/24 ,  H05K7/20 ,  C08L33/08

    摘要： The present invention provides a thermally conductive material containing a disk-like compound as a thermally conductive material having high thermal conductivity and high heat resistance. For example, the present invention provides a thermally conductive material containing a cured substance of a resin composition containing a disk-like compound having two or more functional groups, in which the functional groups are selected from the group consisting of a (meth)acryl group, a (meth)acrylamide group, an oxiranyl group, an oxetanyl group, a hydroxyl group, an amino group, a thiol group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group. The present invention also provides a device, which includes the aforementioned thermally conductive material, and the aforementioned resin composition.