Invention Grant
- Patent Title: Passive fiber to chip coupling using post-assembly laser patterned waveguides
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Application No.: US16260622Application Date: 2019-01-29
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Publication No.: US10962719B2Publication Date: 2021-03-30
- Inventor: Sandeep Razdan , Ashley J. Maker , Jock T. Bovington , Matthew J. Traverso
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: G02B6/30
- IPC: G02B6/30

Abstract:
Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.
Public/Granted literature
- US20200241207A1 PASSIVE FIBER TO CHIP COUPLING USING POST-ASSEMBLY LASER PATTERNED WAVEGUIDES Public/Granted day:2020-07-30
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