Invention Grant
- Patent Title: Long reach vacuum robot with dual wafer pockets
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Application No.: US16828537Application Date: 2020-03-24
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Publication No.: US10968052B2Publication Date: 2021-04-06
- Inventor: Rajkumar Thanu , Damon K. Cox
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: B65G47/91
- IPC: B65G47/91 ; B25J15/06 ; H01L21/67 ; B25J9/00 ; H01L21/687

Abstract:
A robotic handling system includes a transfer chamber and a robot arm disposed within the transfer chamber with an end effector having a longitudinal axis. The end effector includes a first wafer pocket defined within the end effector at a first location and a second wafer pocket defined within the end effector at a second location along the longitudinal axis. A first chamber, coupled to the transfer chamber, is reachable by the first wafer pocket and by the second wafer pocket. A second chamber, coupled to the first chamber, where the first chamber is positioned between the transfer chamber and the second chamber, and the second chamber is reachable by the first wafer pocket but not the second wafer pocket.
Public/Granted literature
- US2141336A Mop Public/Granted day:1938-12-27
Information query
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