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公开(公告)号:US12142503B2
公开(公告)日:2024-11-12
申请号:US18127278
申请日:2023-03-28
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Kopec , Damon K. Cox , Leon Volfovski
IPC: B25J9/16 , G06T1/00 , H01L21/67 , H01L21/677
Abstract: A robotic object handling system comprises a robot arm, an image sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the image sensor to generate sensor data of the object, determine at least one of (i) a rotational error of the object or (ii) a positional error of the object based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error, and cause the robot arm to place the object at the first station without at least one of the rotational error or the positional error.
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公开(公告)号:US11850742B2
公开(公告)日:2023-12-26
申请号:US16850590
申请日:2020-04-16
Applicant: Applied Materials, Inc.
Inventor: Karuppasamy Muthukamatchi , Jeffrey C. Hudgens , Damon K. Cox
CPC classification number: B25J9/04 , B25J9/0009 , B25J9/06 , B25J17/02 , B25J15/0014
Abstract: A robot may include a first arm assembly including a first upper arm rotatable about a first axis; a first forearm adapted for rotation relative to the first upper arm about a second axis; a first wrist member adapted for rotation relative to the first forearm about a third axis; and a first end effector coupled to the first wrist member, wherein the first end effector is moveable along a first path. A second arm assembly may include a second upper arm rotatable about the first axis; a second forearm adapted for rotation relative to the second upper arm about a fourth axis; a second wrist member adapted for rotation relative to the second forearm; and a second end effector coupled to the second wrist member, wherein the second end effector is moveable along a second path that does not overlap the first path. Other apparatus and methods are disclosed.
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公开(公告)号:US11101115B2
公开(公告)日:2021-08-24
申请号:US16824394
申请日:2020-03-19
Applicant: Applied Materials, Inc.
Inventor: Nicholas M. Kopec , Damon K. Cox , Andreas Schmid
IPC: H01J37/32 , H01L21/687
Abstract: A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.
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公开(公告)号:US10710819B1
公开(公告)日:2020-07-14
申请号:US16445550
申请日:2019-06-19
Applicant: Applied Materials, Inc.
Inventor: Rajkumar Thanu , Damon K. Cox
IPC: H01L21/67 , B65G47/91 , B25J9/00 , B25J15/06 , H01L21/687
Abstract: A processing system includes a robot arm with an end effector having a longitudinal axis, the robot arm having a reach of at least 45 inches, wherein the end effector includes: a first wafer pocket defined within the end effector at a first location along the longitudinal axis, wherein the first wafer pocket has the reach of at least 45 inches; and a second wafer pocket defined within the end effector at a second location along the longitudinal axis, wherein the second wafer pocket has a second reach that is less than 45 inches. The end effector is capable of concurrently carrying a first wafer in the first wafer pocket and a second wafer in the second wafer pocket.
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公开(公告)号:US20240042595A1
公开(公告)日:2024-02-08
申请号:US18490137
申请日:2023-10-19
Applicant: Applied Materials, Inc.
Inventor: Karuppasamy Muthukamatchi , Jeffrey C. Hudgens , Damon K. Cox
IPC: B25J9/04 , B25J9/06 , B25J17/02 , B25J9/00 , H01L21/677
CPC classification number: B25J9/04 , B25J9/06 , B25J17/02 , B25J9/0009 , H01L21/67742 , B25J15/0014
Abstract: A method of transporting substrates within an electronic device processing system includes rotating a first upper arm of a first arm assembly of a robot. The rotating causes a first end effector of the first arm assembly to move along a first path. The first arm assembly includes the first upper arm, a first forearm, a first wrist member, and the first end effector configured to support a first substrate. The method further includes rotating a second upper arm of a second arm assembly of the robot. The rotating causes a second end effector of the second arm assembly to move along a second path. The second arm assembly includes the second upper arm, a second forearm, a second wrist member, and the second end effector configured to support a second substrate. The second substrate does not overlap with the first substrate in any operating position of the end effectors.
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公开(公告)号:US20240025670A1
公开(公告)日:2024-01-25
申请号:US18375409
申请日:2023-09-29
Applicant: Applied Materials, Inc.
Inventor: Aaron Green , Nicholas Michael Bergantz , Damon K. Cox , Andreas Schmid
Abstract: A carrier includes a carrier body configured to be supported on a robot to transport one or more process kit rings within a substrate processing system. The carrier further includes fingers extending from the carrier body. The fingers are configured to support the one or more process kit rings. A first finger of the plurality of fingers includes an upper surface that forms a recess to receive the one or more process kit rings.
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公开(公告)号:US11759954B2
公开(公告)日:2023-09-19
申请号:US16860992
申请日:2020-04-28
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Bergantz , Damon K. Cox , Alexander Berger
IPC: B25J9/16 , H01L21/677 , H01L21/67 , H01L21/687 , B65G47/90 , H01L21/68 , B25J11/00 , B25J13/08
CPC classification number: B25J9/1692 , B65G47/905 , H01L21/67167 , H01L21/67196 , H01L21/67259 , H01L21/67706 , H01L21/67742 , H01L21/67745 , H01L21/68 , H01L21/68707 , B25J9/1697 , B25J11/0095 , B25J13/08
Abstract: A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm. The calibration object is transferred to an aligner station using the first robot arm, a second robot arm and/or a load lock, wherein the calibration object has a first orientation at the aligner station. The first orientation at the aligner station is determined. A characteristic error value is determined based on the first orientation. The aligner station is to use the characteristic error value for alignment of objects to be placed in the first station.
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公开(公告)号:US11626305B2
公开(公告)日:2023-04-11
申请号:US16452091
申请日:2019-06-25
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Kopec , Damon K. Cox , Leon Volfovski
IPC: B25J9/16 , H01L21/67 , H01L21/677 , G06T1/00
Abstract: A robotic object handling system comprises a robot arm, a non-contact sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the robot arm to position the object within a detection area of the non-contact sensor, cause the non-contact sensor to generate sensor data of the object, determine at least one of a rotational error of the object relative to a target orientation or a positional error of the object relative to a target position based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error from the object, and cause the robot arm to place the object at the first station, wherein the placed object lacks at least one of the rotational error or the positional error.
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公开(公告)号:US20210291374A1
公开(公告)日:2021-09-23
申请号:US16860992
申请日:2020-04-28
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Bergantz , Damon K. Cox , Alexander Berger
Abstract: A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm. The calibration object is transferred to an aligner station using the first robot arm, a second robot arm and/or a load lock, wherein the calibration object has a first orientation at the aligner station. The first orientation at the aligner station is determined. A characteristic error value is determined based on the first orientation. The aligner station is to use the characteristic error value for alignment of objects to be placed in the first station.
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公开(公告)号:US10968052B2
公开(公告)日:2021-04-06
申请号:US16828537
申请日:2020-03-24
Applicant: Applied Materials, Inc.
Inventor: Rajkumar Thanu , Damon K. Cox
IPC: B65G47/91 , B25J15/06 , H01L21/67 , B25J9/00 , H01L21/687
Abstract: A robotic handling system includes a transfer chamber and a robot arm disposed within the transfer chamber with an end effector having a longitudinal axis. The end effector includes a first wafer pocket defined within the end effector at a first location and a second wafer pocket defined within the end effector at a second location along the longitudinal axis. A first chamber, coupled to the transfer chamber, is reachable by the first wafer pocket and by the second wafer pocket. A second chamber, coupled to the first chamber, where the first chamber is positioned between the transfer chamber and the second chamber, and the second chamber is reachable by the first wafer pocket but not the second wafer pocket.
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