Sensor-based correction of robot-held object

    公开(公告)号:US12142503B2

    公开(公告)日:2024-11-12

    申请号:US18127278

    申请日:2023-03-28

    Abstract: A robotic object handling system comprises a robot arm, an image sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the image sensor to generate sensor data of the object, determine at least one of (i) a rotational error of the object or (ii) a positional error of the object based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error, and cause the robot arm to place the object at the first station without at least one of the rotational error or the positional error.

    Ring removal from processing chamber

    公开(公告)号:US11101115B2

    公开(公告)日:2021-08-24

    申请号:US16824394

    申请日:2020-03-19

    Abstract: A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.

    Long reach vacuum robot with dual wafer pockets

    公开(公告)号:US10710819B1

    公开(公告)日:2020-07-14

    申请号:US16445550

    申请日:2019-06-19

    Abstract: A processing system includes a robot arm with an end effector having a longitudinal axis, the robot arm having a reach of at least 45 inches, wherein the end effector includes: a first wafer pocket defined within the end effector at a first location along the longitudinal axis, wherein the first wafer pocket has the reach of at least 45 inches; and a second wafer pocket defined within the end effector at a second location along the longitudinal axis, wherein the second wafer pocket has a second reach that is less than 45 inches. The end effector is capable of concurrently carrying a first wafer in the first wafer pocket and a second wafer in the second wafer pocket.

    Sensor-based correction of robot-held object

    公开(公告)号:US11626305B2

    公开(公告)日:2023-04-11

    申请号:US16452091

    申请日:2019-06-25

    Abstract: A robotic object handling system comprises a robot arm, a non-contact sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the robot arm to position the object within a detection area of the non-contact sensor, cause the non-contact sensor to generate sensor data of the object, determine at least one of a rotational error of the object relative to a target orientation or a positional error of the object relative to a target position based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error from the object, and cause the robot arm to place the object at the first station, wherein the placed object lacks at least one of the rotational error or the positional error.

    CALIBRATION OF AN ELECTRONICS PROCESSING SYSTEM

    公开(公告)号:US20210291374A1

    公开(公告)日:2021-09-23

    申请号:US16860992

    申请日:2020-04-28

    Abstract: A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm. The calibration object is transferred to an aligner station using the first robot arm, a second robot arm and/or a load lock, wherein the calibration object has a first orientation at the aligner station. The first orientation at the aligner station is determined. A characteristic error value is determined based on the first orientation. The aligner station is to use the characteristic error value for alignment of objects to be placed in the first station.

    Long reach vacuum robot with dual wafer pockets

    公开(公告)号:US10968052B2

    公开(公告)日:2021-04-06

    申请号:US16828537

    申请日:2020-03-24

    Abstract: A robotic handling system includes a transfer chamber and a robot arm disposed within the transfer chamber with an end effector having a longitudinal axis. The end effector includes a first wafer pocket defined within the end effector at a first location and a second wafer pocket defined within the end effector at a second location along the longitudinal axis. A first chamber, coupled to the transfer chamber, is reachable by the first wafer pocket and by the second wafer pocket. A second chamber, coupled to the first chamber, where the first chamber is positioned between the transfer chamber and the second chamber, and the second chamber is reachable by the first wafer pocket but not the second wafer pocket.

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