Invention Grant
- Patent Title: Multi-branch terminal for integrated circuit (IC) package
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Application No.: US16440037Application Date: 2019-06-13
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Publication No.: US10971436B2Publication Date: 2021-04-06
- Inventor: Thomas Stoek , Chii Shang Hong , Chiew Li Tai , Edmund Sales Cabatbat
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00

Abstract:
An example multi-branch terminal for an integrated circuit (IC) package is described herein. An example multi-branch terminal of an integrated circuit (IC), may include a first branch that may include an active bonding with a chip of the IC, wherein the active bonding may include a wire bonded to the chip of the IC; and a second branch that may include a passive bonding with the chip of the IC, wherein the passive bonding may include a capacitor bonded to the second branch and a first terminal of the IC.
Public/Granted literature
- US20200020618A1 MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE Public/Granted day:2020-01-16
Information query
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