Invention Grant
- Patent Title: Ground shield plane for ball grid array (BGA) package
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Application No.: US16400264Application Date: 2019-05-01
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Publication No.: US10971455B2Publication Date: 2021-04-06
- Inventor: Aniket Patil , Kuiwon Kang , Zhijie Wang , Ming Yi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Agent Michelle S. Gallardo
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/04 ; H01L23/49 ; H01L23/498 ; H01L21/52 ; H01L23/556

Abstract:
Certain aspects of the present disclosure provide an integrated circuit (IC) package and techniques for fabricating the IC package. The IC package generally includes a substrate, an IC disposed above the substrate, and a shielding layer coupled to a layer of the substrate, wherein the shielding layer is disposed above the substrate adjacent to the IC, and below an upper surface of the IC.
Public/Granted literature
- US20200350260A1 GROUND SHIELD PLANE FOR BALL GRID ARRAY (BGA) PACKAGE Public/Granted day:2020-11-05
Information query
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