公开(公告)号：US10971455B2

公开(公告)日：2021-04-06

申请号：US16400264

申请日：2019-05-01

Applicant: QUALCOMM Incorporated

Inventor： Aniket Patil ,  Kuiwon Kang ,  Zhijie Wang ,  Ming Yi

IPC: H01L23/552 ,  H01L23/04 ,  H01L23/49 ,  H01L23/498 ,  H01L21/52 ,  H01L23/556

Abstract: Certain aspects of the present disclosure provide an integrated circuit (IC) package and techniques for fabricating the IC package. The IC package generally includes a substrate, an IC disposed above the substrate, and a shielding layer coupled to a layer of the substrate, wherein the shielding layer is disposed above the substrate adjacent to the IC, and below an upper surface of the IC.