Invention Grant
- Patent Title: Gate cut isolation including air gap, integrated circuit including same and related method
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Application No.: US16188408Application Date: 2018-11-13
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Publication No.: US10971583B2Publication Date: 2021-04-06
- Inventor: Hong Yu , Hui Zang , Jiehui Shu
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L27/088 ; H01L21/033 ; H01L21/8234 ; H01L21/764 ; H01L21/768

Abstract:
A gate cut isolation including an air gap and an IC including the same are disclosed. A method of forming the gate cut isolation may include forming an opening in a dummy gate that extends over a plurality of spaced active regions, the opening positioned between and spaced from a pair of active regions. The opening is filled with a fill material, and the dummy gate is removed. A metal gate is formed in a space vacated by the dummy gate on each side of the fill material, and the fill material is removed to form a preliminary gate cut opening. A liner is deposited in the preliminary gate cut opening, creating a gate cut isolation opening, which is then sealed by depositing a sealing layer. The sealing layer closes an upper end of the gate cut isolation opening and forms the gate cut isolation including an air gap.
Public/Granted literature
- US20200152736A1 GATE CUT ISOLATION INCLUDING AIR GAP, INTEGRATED CIRCUIT INCLUDING SAME AND RELATED METHOD Public/Granted day:2020-05-14
Information query
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