- 专利标题: Board to board connector
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申请号: US16555968申请日: 2019-08-29
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公开(公告)号: US10971846B2公开(公告)日: 2021-04-06
- 发明人: Hyun-Hwa So , Hyun-Cheul Na
- 申请人: MPD Corp.
- 申请人地址: KR Incheon
- 专利权人: MPD Corp.
- 当前专利权人: MPD Corp.
- 当前专利权人地址: KR Incheon
- 代理机构: IP & T Group LLP
- 优先权: KR10-2019-0090159 20190725,KR10-2019-0096876 20190808
- 主分类号: H01R13/24
- IPC分类号: H01R13/24 ; H01R12/71 ; H01R13/18 ; H01R12/52 ; H01R13/17
摘要:
A board to board connector may include: a support including: a circumference part having an internal space of which a top and a bottom are open; one or more first protruding parts protruding outward from the top of the circumference part in an obliquely upward direction; and one or more first fixing parts protruding from the bottom of the circumference part; a terminal including: a body having an internal space of which a top and a bottom are open; a second protruding part protruding from the top of the body in an obliquely upward direction; and one or more second fixing parts protruding from the bottom of the body, and disposed on the inside of the circumference part of the support; and an insulating part formed between an inner circumferential surface of the circumference part of the support and an outer circumferential surface of the body of the terminal.
公开/授权文献
- US20210028570A1 BOARD TO BOARD CONNECTOR 公开/授权日:2021-01-28
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