- 专利标题: System, method, and apparatus for attaching structures
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申请号: US16355567申请日: 2019-03-15
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公开(公告)号: US10975207B2公开(公告)日: 2021-04-13
- 发明人: Bouziane Yebka , Philip John Jakes , Tin-Lup Wong
- 申请人: LENOVO (Singapore) PTE. LTD.
- 申请人地址: SG New Tech Park
- 专利权人: LENOVO (Singapore) PTE. LTD.
- 当前专利权人: LENOVO (Singapore) PTE. LTD.
- 当前专利权人地址: SG New Tech Park
- 代理机构: Kunzler Bean & Adamson
- 主分类号: B29C65/00
- IPC分类号: B29C65/00 ; C08J5/12 ; C09J7/38 ; G05B19/04 ; G05B19/042 ; G05B15/02 ; B29C65/02 ; B29C65/56 ; B29C65/76 ; B29C65/78 ; B29C65/58 ; B32B38/10 ; B32B43/00
摘要:
Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.
公开/授权文献
- US20200291196A1 SYSTEM, METHOD, AND APPARATUS FOR ATTACHING STRUCTURES 公开/授权日:2020-09-17
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