The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases. A heat pipe including: a container having a tubular shape in which an end surface of one end part and an end surface of another end part are sealed, the container including an inner wall surface in which a groove part is formed; a sintered body layer provided on the inner wall surface of the container, the sintered body layer being formed by sintering a powder; and a working fluid sealed in a hollow part of the container, wherein: the sintered body layer includes a first sintered part located in an evaporation part of the heat pipe, and a second sintered part located in a heat insulation part between the evaporation part and a condensation part of the heat pipe, the second sintered part being continuous with the first sintered part, and a capillary force of the first sintered part is larger than a capillary force of the second sintered part.