- 专利标题: Memory circuit and semiconductor device
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申请号: US16548808申请日: 2019-08-22
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公开(公告)号: US10978150B2公开(公告)日: 2021-04-13
- 发明人: Masaru Yano
- 申请人: Winbond Electronics Corp.
- 申请人地址: TW Taichung
- 专利权人: Winbond Electronics Corp.
- 当前专利权人: Winbond Electronics Corp.
- 当前专利权人地址: TW Taichung
- 代理机构: JCIPRNET
- 优先权: JPJP2018-206352 20181101
- 主分类号: G11C11/00
- IPC分类号: G11C11/00 ; G11C14/00 ; G11C11/16
摘要:
A memory circuit and a semiconductor device are provided. The memory circuit has a function of recovering data when power is suddenly shutdown. The memory device includes a bi-stable circuit capable of holding complementary data respectively at nodes N1 and N2; a first non-volatile memory circuit, connected to the node; and a second non-volatile memory circuit connected to the node. The first non-volatile memory circuit stores boot data, and the second non-volatile memory circuit inverts a logic level of the data held at the second node when the second non-volatile memory circuit stores data at the second node.
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