Invention Grant
- Patent Title: Device enclosure
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Application No.: US16879525Application Date: 2020-05-20
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Publication No.: US10980140B2Publication Date: 2021-04-13
- Inventor: Lee E. Hooton , Michael B. Wittenberg , Andrew J. Meschke , Alexander W. Williams
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: H05K5/04
- IPC: H05K5/04 ; H05K5/03 ; H05K5/00 ; G06F1/16 ; H05K5/02

Abstract:
An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.
Public/Granted literature
- US20200288593A1 DEVICE ENCLOSURE Public/Granted day:2020-09-10
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