公开(公告)号：US10980140B2

公开(公告)日：2021-04-13

申请号：US16879525

申请日：2020-05-20

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Michael B. Wittenberg ,  Andrew J. Meschke ,  Alexander W. Williams

IPC: H05K5/04 ,  H05K5/03 ,  H05K5/00 ,  G06F1/16 ,  H05K5/02

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

公开(公告)号：US20240031460A1

公开(公告)日：2024-01-25

申请号：US18223337

申请日：2023-07-18

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Alexander W. Williams

IPC: H04M1/02 ,  H05K5/03 ,  H05K5/04

CPC classification number: H04M1/0202 ,  H05K5/03 ,  H05K5/04

Abstract: Electronic devices are disclosed that include metal members bonded to members including a polymer material via a porous metallic layer. The polymer material may at least partially fill and mechanically interlock with pores of the porous metallic layer to form an interlock region.

公开(公告)号：US20210204434A1

公开(公告)日：2021-07-01

申请号：US17200618

申请日：2021-03-12

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Michael B. Wittenberg ,  Andrew J. Meschke ,  Alexander W. Williams

IPC: H05K5/04 ,  H05K5/03 ,  H05K5/00

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

公开(公告)号：US20200288593A1

公开(公告)日：2020-09-10

申请号：US16879525

申请日：2020-05-20

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Michael B. Wittenberg ,  Andrew J. Meschke ,  Alexander W. Williams

IPC: H05K5/04 ,  H05K5/00 ,  H05K5/03

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

公开(公告)号：US09780474B2

公开(公告)日：2017-10-03

申请号：US15069125

申请日：2016-03-14

Applicant: Apple Inc.

Inventor： Brian S. Tryon ,  Alexander W. Williams

IPC: H01R25/00 ,  H01R13/22 ,  H01R13/03

CPC classification number: H01R13/22 ,  G06F1/1656 ,  G06F1/181 ,  G06F1/182 ,  G06F3/00 ,  H01H13/00 ,  H01R13/03 ,  H04M1/0274

Abstract: Electrical contacts are described. An electrical contact can be formed on an exterior surface of a housing of an electronic device and can be cosmetically similar to the exterior surface. For example, the electrical contact can include a conductive plug inserted through an opening in a wall of the housing. A metallic coating can be applied to an outward-facing end of the conductive plug and fill up an outer portion of the opening until the metallic coating is about flush with the exterior surface of the housing. Properties of the metallic coating can be selected to closely match a color and a texture of the housing.

公开(公告)号：US20170090134A1

公开(公告)日：2017-03-30

申请号：US15273624

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Alexander W. Williams ,  Nicholas G. Merz

IPC: G02B6/42 ,  H02J7/02 ,  H02J50/10 ,  G02B6/38 ,  H04B10/114

CPC classification number: G02B6/4293 ,  G02B6/3886 ,  G02B6/4277 ,  H02J7/025 ,  H02J50/10 ,  H02J50/80 ,  H02J50/90 ,  H04B5/0037 ,  H04B10/114

Abstract: Embodiments describe an apparatus for magnetic charging and optical data transferring. The apparatus includes an inductive transmitting coil disposed within a housing, an optically transparent window disposed at a surface of the housing and above the inductive transmitting coil, and a first optical data transfer module disposed within the housing below the optically transparent window. The first optical data transfer module may be to perform at least one of emitting optical signals through the optically transparent window or detecting optical signals passing through the optically transparent window.

公开(公告)号：US12114453B2

公开(公告)日：2024-10-08

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20240284624A1

公开(公告)日：2024-08-22

申请号：US18650720

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20200347492A1

公开(公告)日：2020-11-05

申请号：US16519288

申请日：2019-07-23

Applicant: Apple Inc.

Inventor： Brian S. Tryon ,  Alexander W. Williams ,  James A. Curran ,  Sonja R. Postak

IPC: C23C14/58 ,  B32B15/04 ,  B32B15/20 ,  C23C14/18 ,  C23C14/20

Abstract: A method of forming a surface coating on a component of an electronic device can include depositing an aluminum layer including at least about 0.05 weight percent (wt %) of a grain refiner on a surface of the component by a physical vapor deposition process, and anodizing the aluminum layer to form an anodized aluminum oxide layer having a L* value greater than about 85 in the CIELAB color space.

公开(公告)号：US20200245487A1

公开(公告)日：2020-07-30

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  H04M1/02 ,  G06F1/16 ,  A45C11/00 ,  H05K5/03 ,  H05K5/00 ,  H05K5/02

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.