Invention Grant
- Patent Title: Electronic device assembly
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Application No.: US16369813Application Date: 2019-03-29
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Publication No.: US10984953B2Publication Date: 2021-04-20
- Inventor: Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-070904 20180402
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/30 ; H01G4/012 ; H01G4/12
Abstract:
An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.
Public/Granted literature
- US20190304691A1 ELECTRONIC DEVICE ASSEMBLY Public/Granted day:2019-10-03
Information query
