公开(公告)号：US11798743B2

公开(公告)日：2023-10-24

申请号：US17229393

申请日：2021-04-13

Applicant: TDK CORPORATION

Inventor： Shinya Saito ,  Kenya Tamaki ,  Norihisa Ando ,  Shinya Ito ,  Akihiro Masuda ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi ,  Toshihiro Iguchi

IPC: H01H85/175 ,  H01G4/224 ,  H01G4/232 ,  H01G2/06 ,  H01H85/08 ,  H01G4/38

CPC classification number: H01G4/224 ,  H01G2/065 ,  H01G4/232 ,  H01G4/38 ,  H01H85/08 ,  H01H85/175

Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.

公开(公告)号：US11508521B2

公开(公告)日：2022-11-22

申请号：US17371778

申请日：2021-07-09

Applicant: TDK CORPORATION

Inventor： Kosuke Yazawa

IPC: H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H01G2/06

Abstract: A metal terminal-equipped electronic component includes: an electronic component having a terminal electrode; a conductive cloth member joined to the terminal electrode as a metal terminal; and a cushioning member supporting the electronic component and the cloth member, in which the cloth member is joined to at least a mounting surface of the cushioning member and a joint surface of the cushioning member to which the electronic component is joined, and the terminal electrode of the electronic component is joined to the cloth member on the joint surface of the cushioning member.

公开(公告)号：US10818432B2

公开(公告)日：2020-10-27

申请号：US16121701

申请日：2018-09-05

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/01 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30 ,  H05K3/34 ,  H01F27/29

Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.

公开(公告)号：US12002622B2

公开(公告)日：2024-06-04

申请号：US17371668

申请日：2021-07-09

Applicant: TDK CORPORATION

Inventor： Kosuke Yazawa

IPC: H01G2/10 ,  H01G13/00

CPC classification number: H01G2/103 ,  H01G13/003 ,  H01G13/006

Abstract: A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.

公开(公告)号：US11984260B2

公开(公告)日：2024-05-14

申请号：US17133102

申请日：2020-12-23

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi ,  Koji Utsui ,  Koji Kaneko

IPC: H01G4/224 ,  H01G2/06 ,  H01G4/228

CPC classification number: H01G2/065 ,  H01G4/224 ,  H01G4/228

Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.

公开(公告)号：US11495405B2

公开(公告)日：2022-11-08

申请号：US16816856

申请日：2020-03-12

Applicant: TDK Corporation

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

公开(公告)号：US10804035B2

公开(公告)日：2020-10-13

申请号：US15819804

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Katsumi Kobayashi ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/30 ,  H01G4/38 ,  H01G4/232 ,  H01G4/228 ,  H01G4/248 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

公开(公告)号：US10566139B2

公开(公告)日：2020-02-18

申请号：US16162580

申请日：2018-10-17

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/008 ,  H01G4/30

Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.

公开(公告)号：US10381157B2

公开(公告)日：2019-08-13

申请号：US15928752

申请日：2018-03-22

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Katsumi Kobayashi ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/232

Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.

公开(公告)号：US12062495B2

公开(公告)日：2024-08-13

申请号：US18331358

申请日：2023-06-08

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Takaaki Sato ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/236

CPC classification number: H01G4/224 ,  H01G4/236 ,  H01G4/38

Abstract: An electronic device includes a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.